These wafer-thin dies are designed to cut, emboss or stencil a single sheet of cardstock, paper, metallic foil or vellum.
These die can also emboss when the machine's included Platform is combined with an Impressions Pad and Silicone Rubber sheet.
To stencil, place the die over desired material and apply ink or chalk to the die indentations. This technique can be used alone or to enhance embossed designs.
Includes 1 Die
Size: 10 cm x 10 cm
This die set is compatible with the BIGkick, Big Shot and Vagabond machines